Super Corrosion Resistance: Coating is resistant to plasma, strong acids, and strong alkalis, with a lifespan increased by 3 times.
Atomic-Level Precision: Vacuum coating thickness tolerance of ±5nm, perfectly bonding with microstructures.
High-Efficiency Mass Production: Fully automated line with a daily output of 5,000 units and a yield rate of 99.9%.
"Zero Chemical Residue: Purely physical protection process, certified by SEMI S2.
Solution Overview
This solution is designed for critical semiconductor equipment components (such as vacuum chambers, wafer carriers, valve parts, etc.), utilizing nanometer-level anti-contamination coatings and vacuum coating technology to achieve dust-free protection throughout the CNC machining process. It is compatible with semiconductor-grade materials such as aluminum alloy, stainless steel, and ceramics, ensuring zero particle attachment and ion contamination on the surface, meeting Class 10 cleanroom standards.
① CNC machining generates metal debris, leading to equipment contamination risks.
② Traditional coatings lack sufficient corrosion resistance, leading to high maintenance and replacement costs.
③ Cleanroom standards are stringent, and the protection process yield is below 95%.
④ Incomplete coverage of complex geometric structures (such as gas channels).
⑤ Semiconductor process chemicals cause corrosion, shortening component lifespan by 50%
Advantages of MICROTEC SHIELD
② Amorphous Carbon Coating: Hardness up to Hv3000, resistant to high-temperature corrosion at 800°C.
③ 3D Laser Modeling: Automatically identifies micro-holes / channel structures, ensuring 100% coverage with no blind spots.
④ Foxconn Semiconductor Certification: Complies with the original specifications of ASML and TEL equipment.
⑤ Real-time Monitoring System: SEM/EDS integrated detection, with traceable protection layer quality.
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